PS21865-P - Generation DIP and Mini-DIP-IPM - Mitsubishi Electric Semiconductor
Features:
• Employing 5th generation planar IGBT chips with 0.6µm design rule
or CSTBT™ technology with superior loss performance
• Ultra compact dual or single-in-line transfer mold package
(compatible with 2nd generation)
• Including driver and protection circuitry (UV, SC)
• DIP-IPM with reduction of thermal resistance by 20%
• 2500Vrms isolation voltage
• High-active interface logic for direct connection to a 3V or 5V MCU
• Highest reliability and optimised EMI performance
• Available from 3A to 50A / 600V for motor ratings from 0.1kW to 3.7kW
• Optional with open emitter topology for vector control
• All Mitsubishi DIP and Mini-DIP-IPMs have lead-free terminals
• From January 2006 onwards, all DIP and Mini-DIP-IPMs will
be supplied with completely lead-free technology
**注意 & Noted:
Because of wholesale price is different from sample price, our website can not state. Please send your required part number via email to Sales@hkmjd.com or add our skype id mjdccm898 for online talking.As well as welcome you call us : 0755-83957301 We will send offer for you; Sometimes manufacturer's price is unstable, so we don't adjust price in time. if you feel price is a little high for you, just feel free to contact us for consultation. Thank you for your support !
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