Features

 Low-voltage and Standard-voltage Operation

– 1.8 (VCC = 1.8 to 5.5V)

 Internally Organized 4096 x 8, 8192 x 8

 2-Wire Serial Interface

 Schmitt Trigger, Filtered Inputs for Noise Suppression

 Bi-directional Data Transfer Protocol 

 1 MHz (5.0V) and 400 KHz (1.8V Compatibility)

 Write Protect Pin for Hardware Data Protection

 32-Byte Page Write Mode (Partial Page Writes Allowed)

 Self-Timed Write Cycle (5 ms max)

 High Reliability

– Endurance: 1 Million Write Cycles 

– Data Retention: 100 Years

 Lead-free/Halogen-free Devices

 8-lead PDIP, 8-lead JEDEC SOIC, 8-lead Ultra Lead Frame Land Grid Array (ULA), 8-lead 

TSSOP, 8-lead Ultra Thin Mini-MAP (MLP2x3), and 8-ball dBGA2 Packages.

 Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers

 

 

 

 

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